Overview

clean paper

From its English name, we can see the two main characteristics of clean paper: one is that the raw material is wood pulp fiber; the other is the use of airlaid technology. The production process of non-woven fabrics is mainly two processes of network formation and reinforcement. The production of dry-laid nonwovens mainly adopts two methods: chemical bonding and thermal bonding. According to the different reinforcement processes, its raw materials and uses are different, which are introduced separately below.

Uses of dust-free wipes:

Semiconductor production line chips, microprocessors, semiconductor assembly production lines, disk drives, composite materials, LCD display products, circuit board production lines, precision instruments, optical products, aviation industry, PCB products, medical equipment, laboratories, clean rooms and Production lines and other high-precision manufacturing.

Optional edging:

Ultrasonic, laser, cold cutting.

Scope of application:

Semiconductor assembly, aviation manufacturing and maintenance, laboratory, electronics industry, computer assembly, optical instrument manufacturing, LCD liquid crystal display, precision instruments, optical products, aviation industry, and circuit board production lines, etc.; especially suitable for non-semiconductor industry, electronic industry production Class 10-10000 purification plant. Excellent dust removal effect, with anti-static function, efficient water absorption, soft and will not damage the surface of the object.

Especially suitable for dust-free purification workshop. The edges of the clean cloth, clean wiping cloth, microfiber clean cloth and microfiber wiping cloth are edge-sealed by the most advanced edge trimmer, which will not leave particles and lint after wiping, and has strong decontamination ability. You can use the method of melting and sealing on both sides and heat-sealing on the other two sides, or melting and sealing on four sides, which can provide better edge-sealing protection.

use:

1. Semiconductor production line chips, microprocessors, etc.;

2. Semiconductor assembly line;

3. Disc drive, composite material;

4. LCD display products;

5. Circuit board production line;

6. Precision instruments;

7. Optical products;

8. Aviation industry;

9. PCB products;

10. Medical equipment;

11. Laboratory;

12. Dust-free workshop and production line.

13. Advertising color printing

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chemical bonding

The chemical bonding method uses 100% wood pulp fiber as the raw material. After the fibers opened into single fibers are air-laid, the water-soluble adhesive is sprayed on the surface of the fiber web by spraying method, and then baked and consolidated into cloth. The main uses of the products are industrial wipes, feminine hygiene products, baby wipes, tablecloths, wet face towels and cooking cloths.

thermal bonding

The thermal bonding method is to mix hot-melt fibers into wood pulp fibers, and the mixing ratio is generally not less than 15%. After air-laid, the low-melting fibers in the fiber web are melted by hot air or hot rolling, and the fiber web is reinforced into cloth. . Thermal bonding non-woven fabrics have better bulkiness and hygroscopicity because they do not contain chemical adhesives. They are mainly used as absorbent cores of high-absorbent sanitary products, thin feminine sanitary napkins, etc. For this purpose, some production lines are equipped with superabsorbent resin (SAP) powder application devices. Due to the addition of polymer water-absorbing resin, the water can be turned into a solid after absorbing water, which greatly improves its water-absorbing capacity.

To sum up, although dust-free paper is called paper, it is essentially a non-woven fabric.

Related tags: Industrial Wiper Rolls, 100% Polyester Cleanroom Wipers